0910-1-57-20-75-14-11-0
Mill-Max Manufacturing Corp.

Mill-Max Manufacturing Corp.
CONTACT SPRING LOADED SMD GOLD
$1.20
Available to order
Reference Price (USD)
1,500+
$0.44310
3,000+
$0.42833
7,500+
$0.41356
10,500+
$0.39288
15,000+
$0.38402
Exquisite packaging
Discount
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Experience the future of test interface technology with Mill-Max Manufacturing Corp.'s 0910-1-57-20-75-14-11-0 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The 0910-1-57-20-75-14-11-0 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, 0910-1-57-20-75-14-11-0 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Surface Mount
- Maximum Working Height: 0.177" (4.50mm)
- Recommended Working Height: 0.150" (3.80mm)
- Minimum Working Height: 0.122" (3.10mm)
- Pad Layout Dimension: Circular - 0.072" (1.83mm)
- Operating Force - Initial: 25gf
- Operating Force - Mid Compression: 60gf
- Plunger Size: 0.042" (1.07mm) Dia
- Features: -
- Mating Cycles: 1000000
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)