216-6278-00-3303
3M
3M
CONN IC DIP SOCKET ZIF 16POS GLD
$0.00
Available to order
Reference Price (USD)
1+
$12.50000
10+
$11.36000
25+
$11.07600
50+
$10.22400
100+
$9.65600
300+
$8.80400
500+
$8.23600
1,000+
$7.55440
Exquisite packaging
Discount
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The 216-6278-00-3303 by 3M is a top-quality socket designed for ICs and transistors, offering exceptional reliability and ease of use. These sockets feature a robust design that ensures stable connections and protects components during insertion and removal. Ideal for high-frequency and high-speed applications, the 216-6278-00-3303 delivers superior signal integrity. Common uses include computer motherboards, medical devices, and aerospace systems. With 3M's commitment to excellence, this socket is a trusted choice for engineers and technicians worldwide. Whether for prototyping or mass production, the 216-6278-00-3303 provides a seamless solution for your interconnect requirements.
Specifications
- Product Status: Obsolete
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 250.0µin (6.35µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 250.0µin (6.35µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyether Imide (PEI), Glass Filled
- Operating Temperature: -55°C ~ 105°C
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