2209-6317-9UA-1902
3M
3M
GRID ZIP
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Engineered for excellence, the 2209-6317-9UA-1902 IC and transistor socket from 3M offers unmatched reliability and performance. These sockets are designed to simplify the installation and replacement of ICs and transistors, reducing the risk of damage. Perfect for high-reliability applications, the 2209-6317-9UA-1902 is used in military, medical, and telecommunications equipment. Its robust construction ensures durability even in extreme conditions. Trust 3M to deliver high-quality interconnects that meet the demands of modern electronics. The 2209-6317-9UA-1902 is the ideal choice for professionals seeking precision and durability in their components.
Specifications
- Product Status: Obsolete
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 209 (17 x 17)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -55°C ~ 150°C
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