808-AG11D
TE Connectivity AMP Connectors

TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
$2.62
Available to order
Reference Price (USD)
1+
$2.65000
10+
$2.40800
25+
$2.26040
60+
$2.16200
120+
$2.06367
300+
$1.86713
540+
$1.71972
1,020+
$1.47405
2,520+
$1.37578
Exquisite packaging
Discount
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The 808-AG11D by TE Connectivity AMP Connectors is a high-performance socket tailored for ICs and transistors, providing secure and stable connections. Its precision-engineered design ensures minimal contact resistance and optimal signal transmission. Suitable for both through-hole and surface-mount applications, this socket is a favorite among electronics professionals. Applications range from home appliances to advanced robotics and IoT devices. With TE Connectivity AMP Connectors's reputation for quality, the 808-AG11D is a dependable choice for any project requiring reliable interconnects. Invest in this socket for enhanced performance and longevity in your electronic assemblies.
Specifications
- Product Status: Obsolete
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25.0µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 80.0µin (2.03µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C