DILB24P-223TLF
Amphenol ICC (FCI)
Amphenol ICC (FCI)
CONN IC DIP SOCKET 24POS TINLEAD
$0.86
Available to order
Reference Price (USD)
1+
$0.45000
10+
$0.42100
25+
$0.36080
50+
$0.30680
100+
$0.29470
250+
$0.26468
500+
$0.25264
1,000+
$0.21053
2,500+
$0.19248
Exquisite packaging
Discount
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The DILB24P-223TLF by Amphenol ICC (FCI) is a top-quality socket designed for ICs and transistors, offering exceptional reliability and ease of use. These sockets feature a robust design that ensures stable connections and protects components during insertion and removal. Ideal for high-frequency and high-speed applications, the DILB24P-223TLF delivers superior signal integrity. Common uses include computer motherboards, medical devices, and aerospace systems. With Amphenol ICC (FCI)'s commitment to excellence, this socket is a trusted choice for engineers and technicians worldwide. Whether for prototyping or mass production, the DILB24P-223TLF provides a seamless solution for your interconnect requirements.
Specifications
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 100.0µin (2.54µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 100.0µin (2.54µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyamide (PA), Nylon
- Operating Temperature: -55°C ~ 125°C
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