J-2109PU-1-00-0000
Yokowo
Yokowo
CONTACT SPRING LOADED SMD GOLD
$1.17
Available to order
Reference Price (USD)
1+
$1.17000
500+
$1.1583
1000+
$1.1466
1500+
$1.1349
2000+
$1.1232
2500+
$1.1115
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Experience the future of test interface technology with Yokowo's J-2109PU-1-00-0000 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The J-2109PU-1-00-0000 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, J-2109PU-1-00-0000 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Surface Mount
- Maximum Working Height: 0.118" (3.00mm)
- Recommended Working Height: 0.094" (2.40mm)
- Minimum Working Height: 0.080" (2.00mm)
- Pad Layout Dimension: Circular - 0.082" (2.08mm)
- Operating Force - Initial: -
- Operating Force - Mid Compression: -
- Plunger Size: -
- Features: -
- Mating Cycles: 20000
- Contact Material: -
- Contact Finish: -
- Contact Finish Thickness: -
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