LPC1823JET100E

NXP USA Inc.

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT 512KB FLSH 100TFBGA

Datasheet:

LPC1823JET100E Datasheet

$18.40

Available to order

Reference Price (USD)

$11.87000

10+

$10.72400

25+

$10.22560

260+

$8.47962

520+

$7.73140

1,040+

$6.73380

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

The NXP USA Inc. LPC1823JET100E sets new standards in the Embedded - Microcontrollers segment of Integrated Circuits (ICs). Combining {technology 1} with {technology 2}, this microcontroller delivers unparalleled {performance aspect} for mission-critical applications. It's widely adopted in automotive ADAS systems, industrial robotics (articulated arms, CNC controllers), and smart grid infrastructure. The LPC1823JET100E features {memory type} with {size} capacity and {connectivity option} for flexible system integration. Developers appreciate its {toolchain support} and {debugging feature} for reduced time-to-market. With {reliability metric} MTBF and {safety certification} compliance, this microcontroller ensures dependable operation in {challenging condition} conditions while providing {key advantage} over competing solutions.

Specifications

Product Status: Active
Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O: 49
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 104K x 8
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Data Converters: A/D 4x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (9x9)