LPC43S70FET100E

NXP USA Inc.

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 100TFBGA

Datasheet:

LPC43S70FET100E Datasheet

$15.73

Available to order

Reference Price (USD)

$10.15000

10+

$9.16500

25+

$8.73920

260+

$7.24712

520+

$6.60765

1,040+

$5.75505

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

The LPC43S70FET100E from NXP USA Inc. redefines expectations for Embedded - Microcontrollers in the Integrated Circuits (ICs) market. Featuring {core technology} technology with {performance metric}, these microcontrollers handle complex algorithms while maintaining ultra-low power consumption. Ideal for energy harvesting applications, wireless sensor networks, and industrial IoT gateways, the LPC43S70FET100E offers {communication protocol} support and {development tool} compatibility. Engineers choose this series for {application area 1} and {application area 2} due to its {advantage 1} and {advantage 2}. With {temperature range} operating range and {longevity promise} product lifecycle, it's built for reliability in harsh environments and long-term deployments.

Specifications

Product Status: Active
Core Processor: ARM® Cortex®-M4/M0
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O: 49
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 282K x 8
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (9x9)