SAC57D54HCVMO557

NXP USA Inc.

Manufacturer

NXP USA Inc.

Description:

ARM 32 BIT MCU, TRIPLE CORE, 4MB

Datasheet:

SAC57D54HCVMO557 Datasheet

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Reference Price (USD)

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Enhance your projects with the SAC57D54HCVMO557 Memory IC from NXP USA Inc., a top-tier component in the Memory category. This IC is designed to deliver high-speed data access and substantial storage capacity, meeting the needs of sophisticated electronic systems. Its innovative design ensures optimal performance and energy efficiency. The SAC57D54HCVMO557 exemplifies the key characteristics of Memory ICs: high reliability, fast data transfer, and compact form factors. These ICs are crucial for devices that require instant data retrieval and storage, such as smartphones and embedded systems. The SAC57D54HCVMO557 provides these benefits while maintaining low power consumption and thermal efficiency. This Memory IC is widely used in applications like networking equipment, IoT devices, and automotive electronics. For example, it is integral to routers and switches that manage high volumes of data traffic. It also plays a vital role in smart home devices, enabling seamless operation. The SAC57D54HCVMO557 is a superior choice for high-performance Memory ICs.