XCVM1802-2LLEVSVD1760

AMD Xilinx

Manufacturer

AMD Xilinx

Description:

IC VERSAL AICORE FPGA 1760BGA

Datasheet:

XCVM1802-2LLEVSVD1760 Datasheet

$15,702.18

Available to order

Reference Price (USD)

$15702.18000

500+

$15545.1582

1000+

$15388.1364

1500+

$15231.1146

2000+

$15074.0928

2500+

$14917.071

Exquisite packaging

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Meet the XCVM1802-2LLEVSVD1760 AMD Xilinx's ultra-compact SoC designed for space-constrained embedded applications. This IC packs processing, wireless connectivity (Wi-Fi/Bluetooth), and sensor interfaces into a single chip, ideal for wearables and asset trackers. Its ultra-low-power modes extend battery life in portable devices, while the rich peripheral set supports rapid prototyping. Deploy the XCVM1802-2LLEVSVD1760 in health monitors, beacons, or environmental sensors for a competitive edge. AMD Xilinx combines innovation and practicality in this game-changing SoC.

Specifications

Product Status: Active
Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 450MHz, 1.08GHz
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)