807-22-001-10-002101
Mill-Max Manufacturing Corp.

Mill-Max Manufacturing Corp.
CONTACT SPRING LOADED T/H GOLD
$0.79
Available to order
Reference Price (USD)
1+
$1.28000
10+
$1.12400
25+
$1.05800
50+
$1.01380
100+
$0.96980
250+
$0.88160
500+
$0.79344
1,000+
$0.70528
2,500+
$0.63916
Exquisite packaging
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Experience the future of test interface technology with Mill-Max Manufacturing Corp.'s 807-22-001-10-002101 MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The 807-22-001-10-002101 series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, 807-22-001-10-002101 redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Through Hole
- Maximum Working Height: 0.155" (3.94mm)
- Recommended Working Height: 0.135" (3.44mm)
- Minimum Working Height: -
- Pad Layout Dimension: Circular - 0.072" (1.83mm) (TH)
- Operating Force - Initial: 25gf
- Operating Force - Mid Compression: 60gf
- Plunger Size: 0.042" (1.07mm) Dia
- Features: Pick and Place
- Mating Cycles: 1000000
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)