808-AG10D
TE Connectivity AMP Connectors
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
$0.00
Available to order
Reference Price (USD)
1+
$5.08000
10+
$4.87900
25+
$4.47200
60+
$4.26883
120+
$4.06550
300+
$3.55730
540+
$3.45567
1,020+
$2.94747
2,520+
$2.74420
Exquisite packaging
Discount
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The 808-AG10D by TE Connectivity AMP Connectors is a top-quality socket designed for ICs and transistors, offering exceptional reliability and ease of use. These sockets feature a robust design that ensures stable connections and protects components during insertion and removal. Ideal for high-frequency and high-speed applications, the 808-AG10D delivers superior signal integrity. Common uses include computer motherboards, medical devices, and aerospace systems. With TE Connectivity AMP Connectors's commitment to excellence, this socket is a trusted choice for engineers and technicians worldwide. Whether for prototyping or mass production, the 808-AG10D provides a seamless solution for your interconnect requirements.
Specifications
- Product Status: Obsolete
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25.0µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 5.00µin (0.127µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
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