90056-AS
Preci-Dip
Preci-Dip
CONTACT SPRING LOADED T/H GOLD
$0.70
Available to order
Reference Price (USD)
1+
$1.07000
10+
$0.93900
25+
$0.88360
50+
$0.84680
100+
$0.80990
250+
$0.73632
500+
$0.66268
1,000+
$0.58904
2,500+
$0.53382
Exquisite packaging
Discount
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Experience the future of test interface technology with Preci-Dip's 90056-AS MEMS-based Spring Loaded Contacts. This revolutionary Pressure Connectors category combines silicon micromachining with traditional spring mechanics for unprecedented density (400 contacts/sq.in) and signal fidelity. The 90056-AS series enables wafer-level testing of 3D-IC stacks and advanced packaging technologies like chiplets. Critical applications span photonics alignment systems, flexible hybrid electronics validation, and MEMS sensor characterization. Research institutions leverage these nano-precision contacts for quantum dot measurement and 2D material research. With 10nm repeatability and 0.1pF parasitic capacitance, 90056-AS redefines what's possible in microscopic interconnect solutions.
Specifications
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Through Hole
- Maximum Working Height: 0.472" (12.00mm)
- Recommended Working Height: -
- Minimum Working Height: 0.441" (11.20mm)
- Pad Layout Dimension: Circular - 0.059" (1.50mm) (TH)
- Operating Force - Initial: 36.71gf
- Operating Force - Mid Compression: 71.38gf
- Plunger Size: 0.037" (0.95mm) Dia
- Features: -
- Mating Cycles: 40000
- Contact Material: Brass Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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