FF450R33T3E3B5P4BPMA1
Infineon Technologies
Infineon Technologies
IHV IHM T XHP 3 3-6 5K
$2,013.12
Available to order
Reference Price (USD)
1+
$2013.12000
500+
$1992.9888
1000+
$1972.8576
1500+
$1952.7264
2000+
$1932.5952
2500+
$1912.464
Exquisite packaging
Discount
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The FF450R33T3E3B5P4BPMA1 from Infineon Technologies exemplifies excellence in Transistors - IGBTs - Modules technology. This discrete semiconductor solution features a unique direct liquid cooling design for maximum power density. Technical highlights include: 200% overload capability, ultra-thin wafer technology, and short-circuit protection. The module excels in demanding applications such as electric aircraft propulsion, mining equipment, and high-speed rail systems. A typical deployment would be using the FF450R33T3E3B5P4BPMA1 in megawatt-level wind turbine converters. With Infineon Technologies's proven track record, the FF450R33T3E3B5P4BPMA1 represents the future of power semiconductor modules.
Specifications
- Product Status: Active
- IGBT Type: Trench Field Stop
- Configuration: 2 Independent
- Voltage - Collector Emitter Breakdown (Max): 3300 V
- Current - Collector (Ic) (Max): 450 A
- Power - Max: 1000000 W
- Vce(on) (Max) @ Vge, Ic: 2.75V @ 15V, 450A
- Current - Collector Cutoff (Max): 5 mA
- Input Capacitance (Cies) @ Vce: 84 nF @ 25 V
- Input: Standard
- NTC Thermistor: No
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Chassis Mount
- Package / Case: Module
- Supplier Device Package: AG-XHP100-6
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